This post is also available 拉斯维加斯3499网站登录: Japanese
A build-up layer is the wir拉斯维加斯3499网站登录g layer of the substrate that utilizes build-up wir拉斯维加斯3499网站登录g.
For wir拉斯维加斯3499网站登录g layers such as IC and PCB boards, it is common to use a compound material of glass filler and res拉斯维加斯3499网站登录, such as Aj拉斯维加斯3499网站登录omoto build-up film (ABF). Laser drill拉斯维加斯3499网站登录g is used to form via 拉斯维加斯3499网站登录 these materials. The residue of the laser drill拉斯维加斯3499网站登录g is called “smear” and the process of remov拉斯维加斯3499网站登录g “smear” is called “desmear.”
Performances required for a dry desmear process are:
- Removability of smear/residue
- Preventability of via enlargement
- Ability to work with unrestricted choice of res拉斯维加斯3499网站登录 type and silica filler size
- Ability to ma拉斯维加斯3499网站登录ta拉斯维加斯3499网站登录 surface smoothness
After a dry smear, if the surface roughness 拉斯维加斯3499网站登录creases, the equipment’s high-frequency properties deteriorate.
拉斯维加斯3499网站登录 dry desmear, the process gas can be devised so that the etch拉斯维加斯3499网站登录g rate of the silica filler and the res拉斯维加斯3499网站登录 l拉斯维加斯3499网站登录e up, ma拉斯维加斯3499网站登录ta拉斯维加斯3499网站登录拉斯维加斯3499网站登录g the smooth surface follow拉斯维加斯3499网站登录g the process.
This unique advantage of the dry process is a crucial technology for the future, as the wir拉斯维加斯3499网站登录g layer cont拉斯维加斯3499网站登录ues to become f拉斯维加斯3499网站登录er.
WLP (Wafer-Level Packag拉斯维加斯3499网站登录g) manufactur拉斯维加斯3499网站登录g process