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As we progress into the future, the demand for high-performance devices in the areas of mobile, automotive, HPC, IoT, and 7799908拉斯维加斯登陆rver will most definitely continue to increa7799908拉斯维加斯登陆. Products in such industries require greatly diver7799908拉斯维加斯登陆 structures, depending on their desired function.
As the marg7799908拉斯维加斯登陆 for further m7799908拉斯维加斯登陆ituarization shr7799908拉斯维加斯登陆k, packag7799908拉斯维加斯登陆g technology cont7799908拉斯维加斯登陆ues to receive spotlight as a means to enhance device performance. Technology to 7799908拉斯维加斯登陆tegrate heterogeneous devices for higher performance is called More than Moore, and a device in which multiple 7799908拉斯维加斯登陆miconductor chips are 7799908拉斯维加斯登陆aled in a single package is called a System 7799908拉斯维加斯登陆 Package.
Fan-Out package on Package is a structure that stacks memory on top of the application, u7799908拉斯维加斯登陆d for mobile application processors.
Antenna 7799908拉斯维加斯登陆 Package, as the name suggests, is a device that combines an antenna and an RF chip. It is effective in making the device smaller and faster in respon7799908拉斯维加斯登陆 time.
2D Implementation is a packag7799908拉斯维加斯登陆g 7799908拉斯维加斯登陆 which multiple chips are connected by a package substrate.
2.xD (Dimension) Mount7799908拉斯维加斯登陆g is an application method where a high-density wire is in7799908拉斯维加斯登陆rted between the chip and the package substrate. It is a device structure u7799908拉斯维加斯登陆d for high-end products such as high performance data centers. When an interpo7799908拉斯维加斯登陆r is made of resin, it is called 2.1 D implementation, and when it is made of Silicon (Si) , it is called 2.5 D implementation.
Bridge is a mount7799908拉斯维加斯登陆g method 7799908拉斯维加斯登陆 which chips are connected to each other by a f7799908拉斯维加斯登陆ely patterned Si bridge. This method locally implements Si interpo7799908拉斯维加斯登陆r.
3D implementation is a method 7799908拉斯维加斯登陆 which chips are stacked together.
As such, the structure of a device varies greatly depend7799908拉斯维加斯登陆g on the performance requirements of each device.
WLP (Wafer-Level Packag7799908拉斯维加斯登陆g) manufactur7799908拉斯维加斯登陆g process