{"id":3855,"date":"2021-02-11T10:58:15","date_gmt":"2021-02-11T01:58:15","guid":{"rendered":"https:\/\/www.ulvac.co.jp\/wiki\/?p=3855\/"},"modified":"2022-02-22T09:21:49","modified_gmt":"2022-02-22T00:21:49","slug":"process_g_gan_hemt_gate","status":"publish","type":"post","link":"https:\/\/www.ulvac.co.jp\/wiki\/en\/process_g_gan_hemt_gate\/","title":{"rendered":"Forming Gate for GaN-HEMT"},"content":{"rendered":"

There are several gate structure patterns in GaN HEMTs, but all of them require very shallow machining.<\/p>\n

<\/p>\n

Challenge<\/h3>\n

Keep good rate condition<\/strong><\/p>\n

Less damage as much as possible<\/strong><\/p>\n

Selective etching<\/strong><\/p>\n

<\/p>\n

Solution<\/h3>\n

Forming recess structure<\/strong><\/p>\n

Very low rate etching leaves a small amount of AlGaN. (Example of leaving 5 nm by 25 nm etching)<\/p>\n