{"id":3896,"date":"2021-02-16T09:54:05","date_gmt":"2021-02-16T00:54:05","guid":{"rendered":"https:\/\/www.ulvac.co.jp\/wiki\/?p=3896\/"},"modified":"2022-02-21T09:06:19","modified_gmt":"2022-02-21T00:06:19","slug":"process_g_wlp","status":"publish","type":"post","link":"https:\/\/www.ulvac.co.jp\/wiki\/en\/process_g_wlp\/","title":{"rendered":"Wafer-level Packaging (WLP) Manufacturing"},"content":{"rendered":"

WLP is an abbreviation for Wafer-level Packaging, which is one of the mounting technologies expected as mobile devices such as smartphones become more sophisticated and thinner. ULVAC provides techniques such as sputtering, etching and ashing for the WLP manufacturing process.
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Wafer-level Packaging (WLP) manufacturing flow<\/h3>7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆
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1. Redistribution Layer\uff08RDL\uff09First layer<\/h4>7799908拉斯维加斯网站登陆

Process Technology for WLP<\/strong><\/a><\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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2. Photolitho Via<\/h4>7799908拉斯维加斯网站登陆

Perform Descum to improve the contact characteristics between Cu in the Seed layer and Cu plated.<\/p>7799908拉斯维加斯网站登陆

Process Technology for WLP<\/a><\/strong><\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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3. Cu Pillar<\/h4>7799908拉斯维加斯网站登陆

Plating Cu<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

\u00a0\"\"<\/a><\/td>7799908拉斯维加斯网站登陆7799908拉斯维加斯网站登陆

4. Removing Photolitho<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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5. Bonding Chip<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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6. Molding<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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7. Surface polishing<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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8. Redistribution layer\uff08RDL\uff09<\/h4>7799908拉斯维加斯网站登陆

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9. Forming Bump soldering<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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10. Placing one tape with dicing frame<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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11. Removing strip layer<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆

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12. After dicing chips, stripping from dicing frame<\/h4>7799908拉斯维加斯网站登陆<\/td>7799908拉斯维加斯网站登陆<\/tr>7799908拉斯维加斯网站登陆<\/tbody>7799908拉斯维加斯网站登陆<\/table>7799908拉斯维加斯网站登陆

Contact Us<\/strong><\/h4>7799908拉斯维加斯网站登陆

https:\/\/www.ulvac.co.jp\/en\/contact\/elec_inquiry\/<\/a><\/strong><\/h4>7799908拉斯维加斯网站登陆","protected":false},"excerpt":{"rendered":"

WLP is an abbreviation for Wafer-level Packaging, which is one of the mounting technologies expected as mobile devices such as smartphones become more sophisticated and thinner. ULVAC provides techniques such as sputtering, etching and ashing for the WLP manufacturing process.<\/p>\n","protected":false},"author":17,"featured_media":3693,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[73,80],"tags":[],"class_list":["post-3896","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-process-flow-en","category-wlp"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/posts\/3896"}],"collection":[{"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/users\/17"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/comments?post=3896"}],"version-history":[{"count":7,"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/posts\/3896\/revisions"}],"predecessor-version":[{"id":4778,"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/posts\/3896\/revisions\/4778"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/media\/3693"}],"wp:attachment":[{"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/media?parent=3896"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/categories?post=3896"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ulvac.co.jp\/wiki\/en\/wp-json\/wp\/v2\/tags?post=3896"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}