{"id":5341,"date":"2021-11-07T11:29:49","date_gmt":"2021-11-07T02:29:49","guid":{"rendered":"https:\/\/www.ulvac.co.jp\/wiki\/process_g_keyword_bp\/"},"modified":"2023-01-18T08:49:10","modified_gmt":"2023-01-17T23:49:10","slug":"process_g_keyword_bp","status":"publish","type":"post","link":"https:\/\/www.ulvac.co.jp\/wiki\/en\/process_g_keyword_bp\/","title":{"rendered":"What are backing plates?"},"content":{"rendered":"
Backing plates<\/strong><\/em>\u00a0are one of the components of a sputtering cathode. It is shaped to fit the target and attached on the backside of the target.\u00a0\u00a0<\/p>\n Its main functions are as an electrode for discharging, and as a cooling plate to suppress the temperature rise of the target. Copper is often used for its suitable quality for such functions.<\/p>\n Backing plate contains a channel for cooling water inside. As the target itself has no mechanism to attach to the device, it is attached to the backing plate using Indium (In)<\/em>\u00a0or In alloy<\/em> as a bonding material.<\/p>\n <\/p>\n