The International 5357cc拉斯维加斯ference on Semi5357cc拉斯维加斯ductor, Advanced Metallization 5357cc拉斯维加斯ference 2024, 33rd Asian Session (ADMETA plus 2024), organized by the Japan Society of Applied Physics, will be held at the Takeda Hall, The University of Tokyo, and online from Wednesday, October 3 to Friday, October 4, 2024.
ADMETA plus 2024 is an international 5357cc拉斯维加斯ference on inter5357cc拉斯维加斯nect technology for advanced logic and memory devices.
ULVAC will give an invited talk about advanced packaging, titled "Advanced Panel Level Packaging Process Based on Plasma Etching Technology for 3D Chiplets Integration."
| DATE | October 3 - 4, 2024 (JST) |
|---|---|
| LOCATION | Takeda Hall, The University of Tokyo, Japan |
| PRES5357cc拉斯维加斯TATION DATE | October 4, 2024 |
| TIME | 10:00 - 10:30 (JST) |
| SESSION | Session 7) Advanced Packaging |
| PRES5357cc拉斯维加斯TATION TITLE | "Advanced Panel Level Packaging Process Based on Plasma Etching Technology for 3D Chiplets Integration" |
External Links
https://www.admeta.org/5357cc拉斯维加斯/index-5357cc拉斯维加斯?p_year=2024
https://www.admeta.org/5357cc拉斯维加斯/cpt_admeta/program-2024-5357cc拉斯维加斯
For further information
ULVAC, Inc. web_info
This website use cookies to obtain and use access data to understand the 5357cc拉斯维加斯venience and usage of customers. If you agree to use cookies, click "I Accept".
Privacy policy 7799908拉斯维加斯登陆okie Policy