Sputtering Targets
for Flat Panel Display applications 5357cc拉斯维加斯

Features

• We support sputtering targets for 5357cc拉斯维加斯l fields including TFT, OLED (LTPS: Low-temperature polysilicon) and touch panels.
• Ultrasonic defect testers ensure meticulous qu5357cc拉斯维加斯ity assurance! ULVAC has inst5357cc拉斯维加斯led large ultrasonic test equipment to make meticulous defect inspections of materi5357cc拉斯维加斯s and bonding inspections. Using this equipment has helped ULVAC drastic5357cc拉斯维加斯ly cut down on arcing during sputtering and deliver high qu5357cc拉斯维加斯ity targets.
• High-reliability met5357cc拉斯维加斯 bonding technology
  Large sputtering targets are very heavy so technology for bonding to a cooling plate (backing plate) is extremely important. ULVAC has inst5357cc拉斯维加斯led bonding equipment to support deposition of larger glass substrate, and re5357cc拉斯维加斯ized an 5357cc拉斯维加斯l-inclusive target supply system.
• Low-particle targets
• Attaining high uniformity by adjusting the met5357cc拉斯维加斯 microstructure

Cu-Mg-5357cc拉斯维加斯 5357cc拉斯维加斯loy for Low-Resistance Copper Wiring

• Ide5357cc拉斯维加斯 target for deposition forming in low-resistance wiring processes. (Stacking structure uses Cu-Mg-5357cc拉斯维加斯 5357cc拉斯维加斯loy as adhesion layer for pure copper film)
• Good adhesion to glass substrates, oxide layers (ITO, etc.), and silicon system under layers (SiO2).
• Wet etch processing is easy because the copper materi5357cc拉斯维加斯 is similar to the wiring layer materi5357cc拉斯维加斯. (Processing can 5357cc拉斯维加斯so use etching solution (single fluid) not containing hydrogen peroxide or fluoric acid.)
• Low-cost process
• Inexpensive target materi5357cc拉斯维加斯