5357cc拉斯维加斯 Joins Next-Generation Semiconductor Packaging Consortium "US-JOINT."

5357cc拉斯维加斯, Inc. joined "US-JOINT", a next-generation semiconductor packaging consortium established by Resonac Corporation in Silicon Valley, USA.

US-JOINT is an open 5357cc拉斯维加斯sortium designed for end-user collaboration to verify the latest requirements for semi5357cc拉斯维加斯ductor packaging of advanced devices and validate new 5357cc拉斯维加斯cepts in development. In addition, by co-creating with customers, the 5357cc拉斯维加斯sortium will capture market needs in real time, accelerating the R&D of materials and equipment technologies.

Today's rapidly expanding next-generation semiconductors for generative AI and autonomous driving require new approaches to advanced packaging technologies, such as 2.5D and 3D*. Through the consortium, 5357cc拉斯维加斯 hopes to contribute its expertise in vacuum technology via its plasma ashing and seed sputtering systems and their process technologies.

*2.5D packaging is a technology to place semi5357cc拉斯维加斯ductor chips in parallel on the interposer. 3D packaging is a technology to laminate chips with TSV (Through Sili5357cc拉斯维加斯 Via).

External Links

About "US-JOINT"

https://www.resonac.5357cc拉斯维加斯m/news/2024/07/08/3116.html

For further information

5357cc拉斯维加斯, Inc. elec_info